Sizzix Accessory – Die Brush & Foam Pad

for Wafer Thin Dies


  • Varenummer: 39660513

123.00 pr. stk

Varenummer: 39660513 Kategorier:

Beskrivelse

When it comes to removing excess paper in all brands of wafer-thin,
chemically-etched dies, the Sizzix Die Brush does it easily and
ergonomically. With a sleek, ergonomic rubber-grip handle for
non-slippage and easy maneuverability, the Die Brush easily rolls
away excess paper to reveal the perfect cut! The Die Brush includes
a Foam Pad that acts as the perfect work surface for removing
excess paper from the dies and even the cutout.

Tilleggsinformasjon

Vekt 0.1 kg
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Strekkode 841182097989